Rigid-flex design — bend rules that prevent cracked traces.
TL;DR
- Bend radius is everything. Static bends want ≥ 10× flex thickness; dynamic (repeated flexing) wants ≥ 100×. Under-radius is the #1 cause of cracked traces.
- In the flex, route traces perpendicular to the bend, curved (no sharp corners), staggered between layers, and keep copper on the neutral axis. Use a single flex layer for tight dynamic bends; “bookbinder” construction for multilayer flex.
- The rigid-to-flex transition is where boards crack — no plated holes or sharp coverlay edges in the bend, and add a teardrop/strain relief.
Bend radius — the one rule to never break
When a flex bends, the outer surface stretches and the inner compresses; the strain on the copper scales inversely with bend radius. Too tight and the copper work-hardens and cracks. The standard minimums:
Static (bend-to-install): R ≥ 10 × tflex · Dynamic (repeated): R ≥ 100 × tflex
For a 0.2 mm flex, that’s a ≥ 2 mm static / ≥ 20 mm dynamic radius. Dynamic applications (hinges, moving heads) also force single-layer flex with the copper on the neutral axis — multilayer copper in a repeatedly-flexed zone will eventually fail.
Routing rules in the flex region
- Perpendicular to the bend — traces cross the bend line at 90°, never run along it.
- Curved, not cornered — use arcs; sharp corners concentrate strain and etch unevenly.
- Stagger between layers — on 2-layer flex, offset top and bottom traces (not stacked) so the cross-section bends evenly. This is the essence of bookbinder construction for multilayer flex: layers are cut to different lengths so each sits at its natural radius.
- Cross-hatch the reference — solid copper planes stiffen the flex and crack; use a hatched (mesh) pour for flexibility, accepting the impedance/return-path tradeoff.
- No vias or plated holes in the bend — ever. Keep them in the rigid sections.
2-layer flex: staggered curved traces, hatched reference, R = 12× t
The rigid-to-flex transition
The interface between rigid and flex is the highest-stress region. Rules:
- Keep the coverlay/stiffener edge back from the bend, and don’t end it on a sharp line across traces — stagger or radius it.
- No plated through-holes within ~50 mil of the transition.
- Add teardrops where traces meet pads/vias near the transition for strain relief.
- Add stiffeners under connectors and component areas so flexing stress never reaches solder joints.
- Anchor the coverlay into the rigid section so it can’t peel.
Rigid-flex fails at two places: a too-tight bend and a sharp rigid-to-flex edge. Design both deliberately and the board lasts.
Rigid-flex checklist
- ☐ Bend radius ≥ 10× (static) / 100× (dynamic) flex thickness
- ☐ Dynamic bends: single copper layer on the neutral axis
- ☐ Traces perpendicular to the bend, curved, staggered between layers
- ☐ Hatched (not solid) reference copper in the flex
- ☐ No vias/plated holes in the bend or within ~50 mil of the transition
- ☐ Teardrops + staggered coverlay edge at the transition
- ☐ Stiffeners under connectors/components
- ☐ Fab-reviewed stackup (rigid-flex is fab-specific — confirm early)
Need it designed?
Rigid-flex (2–8 layer, bookbinder, dynamic) is in our wheelhouse — see services or scope a project. We confirm the stackup with your fab before routing, because rigid-flex tolerances are fab-specific.
References
- IPC-2223, Sectional Design Standard for Flexible Printed Boards.
- IPC-6013, Qualification and Performance Specification for Flexible Printed Boards.
- DuPont Pyralux / flex material application guides.