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★ Beta · local AI · TRM3

AI that closes the
thermal analysis loop.

Reads your TRM simulation output, estimates component power from the BOM, runs the thermal analysis, catches violations — including the bench-passes-field-fails trap. Nothing leaves your machine.

Phi TRM AI · full analysis · Spartan3_SL1
$ phy trm analyze –project C:\TRM\Spartan3_SL1\
Parsing simulation data…
110 components · 1.85 W total · ambient 20°C
 
Thermal results:
Board range 20.9°C – 47.5°C · U1 FPGA @ 38.2°C
Thermal: 0 FAIL, 0 WARN
 
PDN / electrical check:
! 5V: 8.6% Vdrop (429mV) ❌ — target < 5%
Widen 5V trace to 0.8 mm (IPC-2152)
 
Derating check (70°C enclosure):
! U1 FPGA: bench 38°C → enclosure 88°C ❌ (+3°C over limit)
Add heatsink or increase copper fill near U1
 
! Overall verdict: FAIL — 2 violations before production
Closed loop proven on real Spartan3 board

The thermal AI that catches
what bench testing misses.

U1 FPGA tested at 38°C on the bench. Same board in a 70°C industrial enclosure: 88°C — 3°C over the absolute limit. TRM shows the numbers; Phi TRM AI catches the verdict, flags the violation, and prescribes the fix.

25
TRM MCP tools
130
test assertions passing
±10%
power estimate vs. TRM measurement
0
bytes of design data sent to any cloud
Join early access
How it works

Five steps. All local.

An MCP server bridges the AI to your TRM simulation files. Design data stays on your machine at every step.

01

Point at your TRM project folder

The MCP server indexes your TRM output directory: Components.txt, simulation reports, hotspot data, AltiumData exports. One path, all data.

$ phy trm serve C:\TRM\Spartan3\
25 tools ready on localhost
02

AI estimates power from your BOM

Claude parses the BOM or pick-place file (Altium or Cadence Allegro), classifies each component (FPGA, DDR, LDO, inductor, decap…), and estimates power draw from a verified corpus of 40+ component classes.

Classifying 110 components
U1 FPGA Spartan3 → 0.9W (DDR3)
03

Run TRM, parse the results

After simulation, the AI reads the thermal report (board temperatures, per-component Tmax, Tmean) and the electrical report (Vdrop, RDC, Joule heating per net).

Tmax 47.5°C · Vdrop(5V) 8.6% FAIL
04

Derating check — the bench-vs-enclosure trap

The board looked fine at 20°C bench ambient. In a 70°C industrial enclosure, U1 reaches 88°C — 3°C over its absolute maximum. The AI catches this before production. Every time.

! U1: 38°C bench → 88°C enclosure
! Limit: 85°C. Add copper fill near U1.
05

Engineering verdict + trace fix

One verdict: PASS or FAIL, with the specific violation and IPC-2152 trace-width fix included. The AI calibrates its power estimates against TRM actuals over time — every run makes it more accurate for your board family.

! 5V trace: widen to 0.8mm
Calibrated to Spartan3 corpus
Features

25 TRM MCP tools.

Every tool is read-only or generates output files — no silent modifications to your TRM project.

Shipped

Thermal analysis

Reads TRM simulation reports: board temperature range, per-component Tmax/Tmean, hotspot identification. Views heat-map images directly. Runs derating checks at any ambient temperature.

Shipped

PDN + electrical check

Parses TRM’s electrical simulation: Vdrop per net, RDC, Joule heating. Flags nets over the 5% target. Prescribes trace-width fixes (IPC-2152) with specific millimeter values.

Shipped

Power estimation

Classifies BOM components and estimates power draw from a corpus verified against 40+ real parts (DDR, Artix, Cyclone, STM32, buck, LDO, PHY, op-amp, MOSFET, USB-C). Calibrates estimates against TRM actuals — accuracy improves with every run.

Shipped

Before / after comparison

Compare two simulation runs to see whether a design change fixed the violation. The AI tracks which changes improved Vdrop, reduced Tmax, or resolved a derating failure.

Beta · Q3 2026

TRM + Altium closed loop

AI reads the PDN audit from Phi Altium, applies it to the TRM thermal model, and links decoupling-cap placement changes to Vdrop improvements across both tools.

Phi TRM AI vs. manual workflow

The three steps engineers skip.

Task Phi TRM AI Manual
Power estimation for new board Automatic from BOM — Altium + Cadence Allegro formats Datasheet lookup, 1–2 hours per board
Derating check for enclosure use Built-in — any ambient temperature, per component Rarely done before production
PDN Vdrop verdict + trace fix Automatic — IPC-2152 width prescription per net Separate tool or manual calculation
Before/after simulation comparison One tool call, structured diff Side-by-side screenshots
Heat-map image review Claude views heat maps directly (vision) Manual TRM viewer
Data stays private Always — TRM files never leave machine Depends on toolchain
Real output

Spartan3 SL1 — actual run.

One get_full_analysis call on a real board. Report generated 2026-06-02 from a 2026-06-01 TRM simulation.

get_full_analysis · Spartan3_SL1 · report_2026-06-01
Board: 180 × 51 mm · Ambient: 20°C · Total power: 1.85 W
 
## Thermal Results
Board range: 20.9°C – 47.5°C
U1 (1.0W): Tc = 38.2°C — 47°C margin
0 thermal violations
 
## PDN / Electrical
! 5V: Vdrop 8.6% (429 mV) — target < 5% ❌
RDC = 215 mΩ · Joule = 0.85 W in traces
 
## Derating (70°C enclosure)
! U1 FPGA: 38°C bench → 88°C enclosure ❌ (+3°C over limit)
 
## Action Items
[FAIL] 5V trace: widen to 0.8mm (IPC-2152, 2A, ΔT 10°C)
[FAIL] U1 heatsink or copper fill — enclosure derating
 
! Overall: FAIL · 2 violations
Early access

Be in the first cohort.

The closed-loop pipeline is running. We’re onboarding TRM users to validate the power estimation and derating logic on their own boards. Priority goes to teams running industrial, defense, or automotive designs — where the bench-vs-enclosure trap has the highest cost.

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Also: Phi Altium

AI that reads your live Altium design, classifies nets, audits power delivery, and generates a design review — all locally. Pairs with Phi TRM AI for the full closed loop.

See Phi Altium →