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⎁ Aerospace & defense

Built to fly. Built to survive.

Aerospace and defense PCBs cost real money to re-spin and real lives to get wrong. We design to MIL-PRF-31032/55110, DO-254 airborne-hardware practice and IPC Class 3/3A — with ruggedization specified up front, not bolted on.

Class 3 / 3AIPC reliability
DO-254airborne-hardware aware
MIL-STD-810environmental margin
ASTM E595low-outgassing options
⎁ What you get

The deliverables.

01

Rugged stackup

Filled and capped vias, no via-in-pad surprises, plated-through-hole reliability targets, conformal-coat or potting clearance baked into the floorplan.

02

DO-254 design data

Schematic, layout and verification artifacts structured to support DO-254 DAL-A through DAL-C objectives, with traceability your DER expects.

03

EMI / EMC for MIL-STD-461

RE102, CE102 and CS101 layout discipline: return-current control, shield-can footprints, filtered connectors integrated into the stackup, not added late.

04

Space-grade options

Low-outgassing prepregs (ASTM E595 < 1% TML, < 0.1% CVCM), de-rated voltages and tin-whisker-aware finishes for space and high-rel programs.

⎁ Standards & capabilities

Built for this sector.

Standards we design to

  • AS9100-aware design process
  • DO-254 (airborne electronic hardware)
  • MIL-PRF-31032 / MIL-PRF-55110
  • MIL-STD-810 / MIL-STD-461 / MIL-STD-1275
  • IPC Class 3 / 3A (IPC-6012 / A-600 Class 3)

Mission systems

  • Avionics + flight controllers
  • EW, SIGINT, radar front-ends
  • Power distribution + solid-state SSPCs
  • Sensor and IMU front-ends
  • Comms (Link-16, SDR)

Rugged + space practice

  • Filled / capped / plated-shut vias
  • Conformal coat / parylene / potting
  • De-rated voltages and thermal margin
  • Low-outgassing material selection
  • Tin-whisker mitigation
⎁ Sample engagement

An SDR receiver re-spun for MIL-STD-810 vibration.

The brief

An anonymized SDR module passed at the bench but cracked solder joints during MIL-STD-810 random vibration. The board needed a re-spin, not another test.

What we did

  • Re-oriented heavy connectors to the stiff edge and added staking pads to the largest SMD inductor.
  • Switched the BGA pads to NSMD with rounded-corner copper escapes and added redundant traces on the safety-critical control net.
  • Filled and capped the via-in-pads; bench-correlated the thermal map in TRM before committing to a re-fab.

Outcome

Cleared MIL-STD-810 vibration, MIL-STD-461 RE102 with 3 dB margin, and the customer’s de-rating audit — on the same article.

⎁ FAQ

Common questions.

Are you ITAR registered?

We run controlled-data handling for ITAR projects on request. We aren’t a manufacturer — we’re a US-based design house with the data discipline ITAR work requires, and we’ll sign your TAA or equivalent agreement.

Do you support DO-254 DAL-A?

We support DAL-A through DAL-C layouts: independence, planned verification, traceable design data and review artifacts. Tool qualification and certification credit are your DER’s call — we deliver the data they need.

Can you do space-grade builds?

We pick low-outgassing materials (ASTM E595), de-rated voltages, tin-whisker-aware finishes and Class 3/3A practice. We aren’t flight-heritage on our own — we partner with a certified fab and add a heritage trail.

Make the qualification, not the re-spin.

DO-254 data, MIL-PRF stackup, Class 3 reliability. Fixed-fee band in 60 seconds.