Rugged stackup
Filled and capped vias, no via-in-pad surprises, plated-through-hole reliability targets, conformal-coat or potting clearance baked into the floorplan.
Aerospace and defense PCBs cost real money to re-spin and real lives to get wrong. We design to MIL-PRF-31032/55110, DO-254 airborne-hardware practice and IPC Class 3/3A — with ruggedization specified up front, not bolted on.
Filled and capped vias, no via-in-pad surprises, plated-through-hole reliability targets, conformal-coat or potting clearance baked into the floorplan.
Schematic, layout and verification artifacts structured to support DO-254 DAL-A through DAL-C objectives, with traceability your DER expects.
RE102, CE102 and CS101 layout discipline: return-current control, shield-can footprints, filtered connectors integrated into the stackup, not added late.
Low-outgassing prepregs (ASTM E595 < 1% TML, < 0.1% CVCM), de-rated voltages and tin-whisker-aware finishes for space and high-rel programs.
An anonymized SDR module passed at the bench but cracked solder joints during MIL-STD-810 random vibration. The board needed a re-spin, not another test.
Cleared MIL-STD-810 vibration, MIL-STD-461 RE102 with 3 dB margin, and the customer’s de-rating audit — on the same article.
We run controlled-data handling for ITAR projects on request. We aren’t a manufacturer — we’re a US-based design house with the data discipline ITAR work requires, and we’ll sign your TAA or equivalent agreement.
We support DAL-A through DAL-C layouts: independence, planned verification, traceable design data and review artifacts. Tool qualification and certification credit are your DER’s call — we deliver the data they need.
We pick low-outgassing materials (ASTM E595), de-rated voltages, tin-whisker-aware finishes and Class 3/3A practice. We aren’t flight-heritage on our own — we partner with a certified fab and add a heritage trail.
DO-254 data, MIL-PRF stackup, Class 3 reliability. Fixed-fee band in 60 seconds.