AEC-Q BOM filter
Every active and passive part screened for AEC-Q100/Q101/Q200 grade and temperature class before placement — no late-stage substitutions that void qualification.
Automotive electronics fail thermally, vibrationally and electromagnetically — usually all three. We design PCBs to AEC-Q-qualified parts, IATF 16949-aware processes and CISPR 25 EMC limits, with thermal sign-off backed by TRM.
Every active and passive part screened for AEC-Q100/Q101/Q200 grade and temperature class before placement — no late-stage substitutions that void qualification.
Safety-relevant nets, redundancies and diagnostics laid out for ASIL A–D requirements with independence between channels and diagnostic-friendly placement.
Reverse-battery, load-dump and transient survival in the protection stage; CISPR 25 emissions controlled at the IC pin, not by a heroic downstream filter.
Steady-state and transient (cold-crank, fault) thermal simulation — the report goes in your validation pack, not just a screenshot.
A 5 kW 48 V→12 V converter for a mild-hybrid had to hold up through LV124 cold-crank transients and pass CISPR 25 Class 5 conducted emissions.
Survived 5,000 LV124 cold-crank cycles in qualification; CISPR 25 Class 5 conducted passed on A-sample with a fully AEC-Q BOM.
AEC-Q is a part-level qualification — not a design-house certification. We design WITH AEC-Q-qualified components and to the layout rules those parts assume, so your qualified BOM ships qualified.
We support ASIL A–D layouts: independence between redundant channels, diagnostic coverage, hardware-error-model-friendly placement. Tool-confidence and process audits remain on your side per ISO 26262 part 8.
Yes — high-current bus-bar attach, GaN/SiC gate-loop layout, isolation barriers, and TRM-backed thermal sign-off. Correlation is typically ±3 °C bench-to-sim.
AEC-Q parts, CISPR 25 layout, TRM thermal sign-off. Fixed-fee band in 60 seconds.